Ex Parte Hutchens et alDownload PDFPatent Trial and Appeal BoardFeb 19, 201310991705 (P.T.A.B. Feb. 19, 2013) Copy Citation UNITED STATES PATENT AND TRADEMARKOFFICE UNITED STATES DEPARTMENT OF COMMERCE United States Patent and Trademark Office Address: COMMISSIONER FOR PATENTS P.O. Box 1450 Alexandria, Virginia 22313-1450 www.uspto.gov APPLICATION NO. FILING DATE FIRST NAMED INVENTOR ATTORNEY DOCKET NO. CONFIRMATION NO. 10/991,705 11/18/2004 Chriswell G. Hutchens 063718.0428 8968 7590 02/19/2013 Bradley S. Bowling Baker Botts L.L.P. One Shell Plaza 910 Louisiana Houston, TX 77002-4995 EXAMINER HUR, JUNG H ART UNIT PAPER NUMBER 2824 MAIL DATE DELIVERY MODE 02/19/2013 PAPER Please find below and/or attached an Office communication concerning this application or proceeding. The time period for reply, if any, is set in the attached communication. PTOL-90A (Rev. 04/07) UNITED STATES PATENT AND TRADEMARK OFFICE ____________________ BEFORE THE PATENT TRIAL AND APPEAL BOARD ____________________ Ex parte CHRISWELL G. HUTCHENS, ROGER L. SCHULTZ, CHIA- MING LIU, and JAMES J. FREEMAN ____________________ Appeal 2010-009125 Application 10/991,705 Technology Center 2800 ____________________ Before MAHSHID D. SAADAT, DEBRA K. STEPHENS, and JUSTIN BUSCH, Administrative Patent Judges. STEPHENS, Administrative Patent Judge. DECISION ON APPEAL Appeal 2010-009125 Application 10/991,705 2 Appellants appeal under 35 U.S.C. § 134(a) (2002) from a final rejection of claims 1, 3, 4, 6-26, 43, 45, 46, 48-65, 125, 129, 131, 135, and 137-144. We have jurisdiction under 35 U.S.C. § 6(b). Claims 2, 5, 27-42, 44, 47, 66-124, 126-128, 130, 132-134, and 136 were cancelled. We AFFIRM. Introduction According to Appellants, the invention relates to a memory system for storing one or more bits that includes a substrate comprising sapphire or diamond, a magnetic random access memory (MRAM) array disposed on the substrate, and a memory controller disposed on the substrate and in communication with the MRAM array. (Abstract). STATEMENT OF THE CASE Exemplary Claims Claims 1 and 11 are exemplary claims and are reproduced below: 1. A memory system for storing one or more bits, comprising: a substrate comprising sapphire; a magnetic random access memory (MRAM) array disposed on the substrate; and a memory controller disposed on the substrate and in communication with the MRAM array, where the memory controller comprises: one or more semiconductor devices, where one or Appeal 2010-009125 Application 10/991,705 3 more of the semiconductor devices comprise: an active layer having a thickness tSi and comprising a channel region, the channel region having a length L, where L/tSi is between 11.8 and 25; and an oxide layer disposed on the active layer. 11. A memory system for storing one or more bits, comprising: a substrate comprising sapphire; a magnetic random access memory (MRAM) array disposed on the substrate; and a memory controller disposed on the substrate and in communication with the MRAM array, where the memory controller comprises: one or more P-channel transistors comprising a first portion of the substrate, where the P-channel semiconductor device is characterized by a gain ßp and a leakage current IOFF-p; one or more N-channel transistors in communication with the one or more P-channel transistors, the N-channel transistors comprising a second portion of the substrate, where each N-channel transistor is characterized by a gain ßn and a leakage current IOFF-N; and where, at a predetermined temperature: ßp ≈ ßn; and IOFF-P ≈ IOFF-N. Appeal 2010-009125 Application 10/991,705 4 References Sandhu US 6,358,756 B1 Mar. 19, 2002 Hirai US 2002/0057594 A1 May 16, 2002 Fitzgerald US 2002/0123197 A1 Sep. 5, 2002 Morishita EP 1120818 A1 Aug. 1, 2001 S. Cristoloveanu and G. Reichet, Recent Advances in SOI Materials and Device Technologies for High Temperature , High-Temperature Electronic Materials, Devices and Sensors Conference, IEEE 1998 at pp. 86-93. Bengt Edholm, Lars Vestling, Mats Bergh, Stefan Tiensuu, and Anders Söderbärg, Silicon-On-Diamond MOS-Transistors with Thermally Grown Gate Oxide, Proceedings 1997 IEEE Int’l SOI Conference, Oct. 1997 at pp. 30-31. Mishel Matloubian, Cheng-Eng Daniel Chen, Bor-Yen Mao, Ravishankar Sundaresan, and Gorgon P. Pollack, Modeling of the Subthreshold Characteristics of SOI MOSFET’s with Floating Body, IEEE Trans. Electron Devices, Vol. 37, No. 9 Sept. 1990 at pp. 1985-1990. Philip G. Neudeck, Robert S. Okojie, and Liang-Yu Chen, High- Temperature Electronics – A Role for Wide Bandgap Semiconductors?, Proceedings of the IEEE, Vol. 90., No. 6, June 2002 at pp. 1065-1076. John P. Uyemura, CMOS Logic Circuit Design, Kluwer, (1999). Rejections (1) Claims 1, 3, 4, and 6 stand rejected under 35 U.S.C. § 103(a) as being unpatentable over Sandhu and Morishita. (2) Claims 7-10 stand rejected under 35 U.S.C. § 103(a) as being unpatentable over Sandhu, Morishita, and Cristoloveanu. Appeal 2010-009125 Application 10/991,705 5 (3) Claims 11, 13-15, 22, 25, and 26 stand rejected under 35 U.S.C. § 103(a) as being unpatentable over Sandhu, Fitzgerald, Uyemura, and Matloubian. (4) Claims 16-21 and 138-144 stand rejected under 35 U.S.C. § 103(a) as being unpatentable over Sandhu, Fitzgerald, Uyemura, Matloubian, and Morishita. (5) Claims 12, 23, and 24 stand rejected under 35 U.S.C. § 103(a) as being unpatentable over Sandhu, Fitzgerald, Uyemura, Matloubian, and Neudeck. (6) Claims 125 and 129 stand rejected under 35 U.S.C. § 103(a) as being unpatentable over Sandhu, Morishita, and Neudeck. (7) Claims 43, 45, 46, 48-65, 131, and 135 stand rejected under 35 U.S.C. § 103(a) as being unpatentable over Sandhu, Morishita, Fitzgerald, Uyemura, Matloubian, Cristoloveanu, and/or Neudeck, and Edholm, and Hirai. (8) Claim 137 stands rejected under 35 U.S.C. § 103(a) as being unpatentable over Sandhu, Morishita, Fitzgerald, Uyemura, and Matloubian. We have only considered those arguments that Appellants actually raised in the Briefs. Arguments Appellants could have made but chose not to make in the Briefs have not been considered and are deemed to be waived. See 37 C.F.R. § 41.37(c)(1)(vii)(2011). Appeal 2010-009125 Application 10/991,705 6 ISSUE 1 35 U.S.C. § 103(a): claims 1, 3, 4, 6, 16-21, 43, 45, 46, 48., 125, 129, 131, 135, and 137 Appellants assert their invention is not obvious over Morishita since Morishita does not explicitly disclose a specific length of a channel region, nor does Morishita indicate the proportions of the gate and the channel region, illustrated in Figure 4, are drawn to proportion (App. Br. 8-10; Reply Br. 2-3). Appellants further argue the Examiner does not provide a sufficient rationale as to why an ordinarily skilled artisan would have combined Morishita’s MOSFET with Sandhu’s MRAM array and memory controller but instead uses hindsight reasoning (App. Br. 10). Issue 1a: Has the Examiner erred in finding the combination of Sandhu, Morishita, and Cristoloveanu teaches or suggests “an active layer having a thickness tSi and comprising a channel region, the channel region having a length L, where L/tSi is between 11.8 and 25” as recited in independent claim 1? Issue 1b: Did the Examiner improperly combine the references of Sandhu, Morishita, and Cristoloveanu? ANALYSIS We do not agree with Appellants. Although Appellants are correct to state that the channel region is distinct from the gate (App. Br. 10) and Morishita does not explicitly discuss the channel region length, an ordinarily skilled artisan would have understood Morishita’s Figure 4 as depicting a Appeal 2010-009125 Application 10/991,705 7 thin film transistor wherein the length of the channel region 13, which is positioned below and controlled by the gate 16, corresponds to the gate length. Indeed, we agree with the Examiner’s findings and conclusions that the teachings and suggestions of Morishita are sufficient to lead a skilled artisan to find the channel region length is substantially equal to the gate length. Indeed, even though the Figure 4’s scale, i.e., the ratio of thickness and length of each layer, may not be reliable, we agree with the Examiner that the edge relationship between the channel length and gate length coincide and thus, a skilled artisan would find the gate length is substantially equal to the channel length. In light of this and Morishita’s further disclosure that the gate length is 0.8 µm (and corresponds to the channel length) and a thickness of crystalline silicon layer of 0.03µm or more and 0.7µm or less, we agree with the Examiner that Morishita teaches or at least suggests L/tSi is between 11.8 and 25 (Ans. 4 and 16-17). Additionally, Appellants have not provided sufficient argument or evidence to persuade us the Examiner has used hindsight reasoning in determining and did not provide a sufficient rationale for why a person of ordinary skill in the art would have combined Morishita’s MOSFET with Sandhu’s MRAM array and memory controller (App. Br. 10). Indeed, the Examiner has articulated reasoning with a rational underpinning and Appellants have not persuaded us the reasoning is in error. Accordingly, Appellants have not persuaded us the Examiner erred in finding the combination of Sandhu, Morishita, and Cristoloveanu teaches or suggests the invention as recited in independent claim 1. Appellants relied Appeal 2010-009125 Application 10/991,705 8 on the arguments set forth for claim 1 in arguing the Examiner erred in rejecting independent claims 43, 125, and 131 which recite a commensurate limitation to the disputed limitation of claim 1. Therefore, for the reasons set forth above, we are also not persuaded the Examiner erred in rejecting claims 43, 125, and 131. Dependent claims 3, 4, 6, 16-21, 45, 46, 48, 129, 135, and 137 fall with their respective independent claims. Therefore, the Examiner did not err in rejecting claims 1, 3, 4, 6, 16-21, 43, 45, 46, 48, , 125, 129, 131, 135, and 137 under 35 U.S.C. § 103(a) for obviousness. ISSUE 2 35 U.S.C. § 103(a): claims 7-10 and 49-52 Appellants assert their invention is not obvious over Sandhu, Morishita, and Cristoloveanu because the combination of references does not disclose “a geometry defined by two or more of tSi, TOX, and L; and the geometry, the semiconductor of the active layer, and the oxide of the oxide layer having been selected to limit a ratio ION/IOFF to more than 100 at temperatures up to 125°C, where IOFF is a leakage current flowing through the substrate and ION is a current flowing through the active layer” (App. Br. 11). Specifically, Appellants contend Cristoloveanu’s Figure 7 depicts drain current not leakage current (App. Br. 12). Further, according to Appellants, in its discussion of leakage current, Cristoloveanu does not disclose a selection of the geometry of the device, the semiconductor of the device, or the oxide of the oxide layer and that all these features be selected to limit a Appeal 2010-009125 Application 10/991,705 9 ratio ION/IOFF to more than 100 at temperatures up to 125°C (App. Br. 12; Reply Br. 3-4). Issue 2: Has the Examiner erred in concluding the combination of Sandhu, Morishita, and Cristoloveanu teaches or suggests “a geometry defined by two or more of tSi, TOX, and L; and the geometry, the semiconductor of the active layer, and the oxide of the oxide layer having been selected to limit a ratio ION/IOFF to more than 100 at temperatures up to 125°C, where IOFF is a leakage current flowing through the substrate and ION is a current flowing through the active layer” as recited in claim 7? ANALYSIS We agree with the Examiner’s findings and conclusions and adopt them as our own (Ans. 18-21). Specifically, we agree Cristoloveanu teaches or at least suggests the drain current in the off-state would be a total leakage current observed at the drain when the device is not active (or is “off”') which would inherently include current components associated with any substrate leakage current and any active layer leakage current (Ans. 19). Thus, we agree with the Examiner that Cristoloveanu teaches or at least suggests for any given IOFF, the substrate leakage current component would be smaller than the total drain off-state leakage current shown in Figure 7 and accordingly, ratio ION/IOFF, with IOFF as the smaller substrate leakage current would still be more than 100 at the recited temperatures (Ans. 19- 20). Appeal 2010-009125 Application 10/991,705 10 We further agree with the Examiner that Cristoloveanu teaches or at least suggests a geometry, the semiconductor of the active layer, and the oxide of the oxide layer are selected (Ans. 20-21). We additionally emphasize we are not persuaded such a selection would be “uniquely challenging or difficult for one of ordinary skill in the art” or “represented an unobvious step over the prior art.” Leapfrog Enters., Inc. v. Fisher-Price, Inc., 485 F.3d 1157, 1162 (Fed. Cir. 2007) (citing KSR, 550 U.S. at 418). Moreover, we emphasize Appellants appear to be arguing the references individually, when the Examiner is relying on the combination of Sandhu, Morishita, and Cristoloveanu as teaching or at least suggesting the invention as recited in claim 7 and commensurately recited in claim 9. Appellants relied on the arguments set forth for claim 7 in arguing the Examiner erred in rejecting claims 49 and 52 which recite a commensurate limitation to the disputed limitation of claim 7. Therefore, for the reasons set forth above, we are also not persuaded the Examiner erred in rejecting claims 49 and 52. Accordingly, we are not persuaded the Examiner erred in finding the combination of Sandhu, Morishita, and Cristoloveanu teaches or suggests the invention as recited in claim 7 and commensurately recited in claims 9, 49, and 52. Dependent claims 8, 10, 50, and 51were not separately argued and thus fall with the claims from which they respectively depend. Therefore, the Examiner did not err in rejecting claims 7-10 and 49-52 under 35 U.S.C. § 103(a) for obviousness over Sandhu, Morishita, and Cristoloveanu. Appeal 2010-009125 Application 10/991,705 11 ISSUE 3 35 U.S.C. § 103(a): claims 11-15, 22-26, 53-65, and 138-144 Appellants assert their invention is not obvious over Sandhu, Fitzgerald, Uyemura, and Matloubian because the combination does not teach or suggest: one or more P-channel transistors comprising a first portion of the substrate, where the P-channel semiconductor device is characterized by a gain ßp and a leakage current IOFF-P; one or more N -channel transistors in communication with the one or more P-channel transistors, the N -channel transistors comprising a second portion of the substrate, where each N -channel transistor is characterized by a gain ßn and a leakage current IOFF-N; and where, at a predetermined temperature: ßp ≈ ßn; and IOFF-P ≈ IOFF-N as recited in representative claim 11(App. Br. 12-13). Specifically, Appellants contend none of the references teaches or suggests a beta matched circuit where the beta matching is performed at a predetermined temperature (App. Br. 13). According to Appellants, Fitzgerald discusses symmetrical inverters, Uyemura discusses equations for transconductance and symmetrical inverters, and Matloubian discusses an SOI transistor model and an equation for a MOSFET channel circuit; however, none of these references, alone or in combination, teach or suggest beta matching at a predetermined temperature (id.). Further, Appellants assert “the mere fact that a thing inherently operates at a temperature does not mean that the temperature was determined beforehand” (Reply Br. 4). Appeal 2010-009125 Application 10/991,705 12 Issue 3: Has the Examiner erred in concluding the combination of Sandhu, Fitzgerald, Uyemura, and Matloubian teaches or suggests “where, at a predetermined temperature: ßp ≈ ßn; and IOFF-P ≈ IOFF-N” as recited in claim 11? ANALYSIS We agree with the Examiner’s findings and conclusions and adopt them as our own. We highlight that we agree with the Examiner that the combination of references “collectively teach the desirability of a symmetrical design in a CMOS circuit device, the symmetrical design including beta matching (i.e., ßp ≈ ßn . . .)” (Ans. 21). We further emphasize we agree the circuit/device “would be inherently operating at a predetermined temperature, one would consider the predetermined operating temperature in designing the symmetrical, beta-matched CMOS circuit/device” (id.). Indeed, all of the relationships taught and suggested by the relied upon references, Sandhu, Fitzgerald, Uyemura, and Matloubian, are true for the operating temperature range of actual devices (see e.g., Matloubian pg. 1985, ¶Abstract). Therefore, we are not persuaded an ordinarily skilled artisan would have found setting the characteristics at a predetermined temperature (as broadly, but reasonable construed) unusually challenging or beyond one of ordinary skill in the arts’ abilities. Accordingly, we are not persuaded the Examiner erred in finding the combination of Sandhu, Fitzgerald, Uyemura, and Matloubian teaches or suggests the invention as recited in claim 11 and commensurately recited in Appeal 2010-009125 Application 10/991,705 13 independent claims 22, 53, and 61 and dependent claims 12-15, 23- 26, 54- 60, 62-65, and 138-144, not separately argued. Therefore, the Examiner did not err in rejecting claims 11-15, 22- 26, 53-65, and 138-144 under 35 U.S.C. § 103(a) for obviousness over Sandhu, Fitzgerald, Uyemura, and Matloubian. DECISION The Examiner’s rejections of claims 1, 3, 4, 6-26, 43, 45, 46, 48-65, 125, 129, 131, 135, and 137-144 under 35 U.S.C. § 103(a) is affirmed. No time period for taking any subsequent action in connection with this appeal may be extended under 37 C.F.R. § 1.136(a)(1)(iv) (2011). AFFIRMED tj Copy with citationCopy as parenthetical citation